System on a Chip White Papers

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First the Tick, Now the Tock: Next Generation Intel Microarchitecture - Nehalem
sponsored by Intel Corporation
WHITE PAPER: Read this paper and get a look at how the next generation microarchitecture's dynamically scalable and design-scalable features directly contribute to power efficiency and performance.
Posted: 03 Apr 2009 | Published: 02 Apr 2009

Intel Corporation

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell

Dell PowerEdge C8000 Series: Flexible, Powerful, and Efficient
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this brief resource to learn about the Dell PowerEdge C8000 – the only shared infrastructure which enables organizations to easily reconfigure, refresh and scale out as needed.
Posted: 19 Feb 2014 | Published: 19 Feb 2014

Dell, Inc. and Intel®

Enterprise Solution Design for SAP HANA
sponsored by HP & Intel®
WHITE PAPER: In this resource, explore the three principles of great enterprise design—stability, scalability, and agility—and learn how to apply them to your SAP landscape with a focus on SAP HANA. Read on for best practices and key design considerations for implementing your SAP HANA enterprise-level solution.
Posted: 25 Sep 2013 | Published: 28 Feb 2013

HP & Intel®

Dell PowerVault MD3000 1000 Mailbox Local Continuous Replication Microsoft Exchange 2007 Storage Solution
sponsored by DellEMC and Intel®
WHITE PAPER: This white paper describes a tested and validated storage solution for a 1000 mailbox Exchange Server 2007 environment with Local Continuous Replication (LCR) feature.
Posted: 27 Aug 2008 | Published: 27 Aug 2008

DellEMC and Intel®

Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Going Parallel with LabVIEW Delivers Throughput Gains
sponsored by National Instruments
WHITE PAPER: In this whitepaper learn how by combining technologies with NI Lab VIEW parallel programming software and NI TestStand test management software, test engineers can create high-performance test systems.
Posted: 16 Sep 2008 | Published: 16 Sep 2008

National Instruments

Dell: Expanding Its Position as an HPC Market Leader
sponsored by Dell, Inc. and Intel®
WHITE PAPER: With several offerings available, choosing the ideal high performance computing (HPC) offering for your business can be a daunting task. This resource examines one well-reputed HPC vendor and explains how it differentiates itself in the competitive marketplace.
Posted: 02 Apr 2012 | Published: 01 Apr 2011

Dell, Inc. and Intel®

IT Security: Built-In Protection with Intel vPro Technology
sponsored by Intel
WHITE PAPER: New security threats are constantly emerging, and it is your responsibility to properly protect your business. This white paper discusses four key aspects of IT security and explains how you can effectively address them by implementing processors with built-in security features.
Posted: 12 Jun 2012 | Published: 01 May 2012

Intel

Oracle x86 Rack Servers Optimized for Rapid Deployments and Operational Efficiency
sponsored by Oracle Corporation
WHITE PAPER: This white paper reveals key factors to consider when selecting a server and explains why more and more organizations are relying on x86 platforms. Access key findings from your peers concerning their spending on servers, power and cooling expenses, and more.
Posted: 07 Oct 2011 | Published: 01 Feb 2011

Oracle Corporation